电镀层的应力理论
童修强,唐详云
摘要(Abstract)：
了解电镀层应力的有关理论无疑对从本质上控制或避免生产实际中电镀层的应力具有重要意义。然而,至今没有一个统一的镀层理论能够解释所有的镀层应力现象,而且各种理论也不尽完善。本文综述了现有的五种电镀层的应力理论,分析了各理论的适用性及它们之间的相互联系,并例举国外最新的有关研究结果进行了说明。
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作者(Author): 童修强,唐详云
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参考文献(References)：
- [1] R. Subramanian, C. Balasingh and B. A. Shcnoi, Metal Finish., Vol. 65 (1967) №3, P67,№4, P54, №5, P58, №6, P101
- [2] Joseph B. Kushner, Metal Finish. , Vol. 56 (1958) №4 ,P46, №5 ,P82, №6, P52, №7, P52
- [3] R. Well, Plating, Vol. 58(1972) 50
- [4] 黄子勋,吴纯素,电镀理论,中国农业机械出版社(1982) 34,118
- [5] J. B. Kushner, Proc. of the International Conference on Electrodeposition and Metal Finishing (1972) 334
- [6] T. P. Hoar and D. J. Arrowsmith, Trans. Inst. Met. Finish., Vol. 36 (1958) 1
- [7] S. Nakahara, and E.C. Felder, J. Electrochem. Soc. , Vol. 129, 1 (1982) 45
- [8] S. Nakahara, ibid, Vol. 125, 7 (1978) 1049
- [9] H. Feigenbaum and R. Weil, Plating and Surface Finishing, Vol. 66, 5 (1979) 64
- [10] R. Well, ibid, Vol. 69, 12 (1982) 46
- [11] Ho Feigenbaum and R. Weil, J. Electrochem. Soc., Vol. 126 (1979) 2085
- [12] B. Martin, Proc. Am. Electroplater's Soc., Vol. 32 (1944) 206
- [13] A. Brenner, Victor Zentner and C. W. Jennings, ibid, Vol. 39 (1952) 865, 933
- [14] R. Weil and G. J. Stanko and D. E. Moser, Plating and Surface Finishing, Vol. 63, 9 (1976) 34
- [15] R. Weil and J. B. C. Wu, Plating, Vol. 60 (1973) 622
- [16] H. Fischer, "Electrolytic Deposition and Electrocrystallization of Metals", Berlin, Springer-Verlag, (1954)