刘松涛;王俊勃;杨敏鸽;思芳;曹风;

• 1:西安工程大学机电工程学院

摘要(Abstract)：

以氧化铜(Cu O)和氧化镧(La2O3)为掺杂剂,采用高能球磨工艺制备纳米Sn O2粉体,再将粉体与银粉(Ag)通过球磨混粉制成银氧化锡复合粉体,分别采用模压工艺和热挤压工艺制成银的质量分数为82%的纳米掺杂Ag/Sn O2触头材料。利用扫描电子显微镜、电导率测试仪、显微硬度仪和热重分析仪对制备的粉体和触头材料进行显微组织观察及性能测试,并分析热挤压工艺对触头材料显微组织和性能的影响。结果表明:经球磨混粉制备的复合粉体中氧化物在银基体中分布均匀;热挤压工艺制备的Ag/Sn O2触头材料的密度、硬度和电导率分别比模压工艺提高6.25%、55.19%和10.75%,热失重百分率减少了1.55%。

关键词(KeyWords)： 高能球磨;热挤压工艺;纳米掺杂Ag/Sn O2触头材料

Abstract:

Keywords:

基金项目(Foundation): 陕西省教育厅科学研究计划自然科学专项(14JK1314)

作者(Author): 刘松涛;王俊勃;杨敏鸽;思芳;曹风;

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DOI:

参考文献(References)：

• [1]Wang Jun,Zhou Xuan,Lu Lin,et al.Microstructure and properties of Ag/Sn O2coatings prepared by cold spraying[J].Syrface﹠Coatings Technology,2013,236:224-229.
• [2]Verm P,Pandey O P,Verma A.Influence of metal oxides on the drc erosion behaviour of silver metal oxides electrical contact materials[J].Materials Science and Technology,2004,20:49-54.
• [3]Milenko B,Valery V k,Nikolai K M.Electrical contacts metalfundamentals oxidesapplications and technology[M].New York:CRC Press,2006:71-148.
• [4]凯尔A,默尔W A,维纳里库E.电接触和电接触材料[M].北京:机械工业出版社,1984:196-206.
• [5]Liu X M,Wu S L,Chu Paul K,et al.Effects of coating process on the characteristics of Ag-Sn O2contact materials[J].Materials Chemistry and Physics,2006(98):477-480.
• [6]Cosovic V,Cosovic A,Talijan N,et al.Improving dispersion of Sn O2nanoparticles in Ag-Sn O2electrical contact materials using template method[J].Journal of Alloys and Compounds,2013,567:33-39.
• [7]Zheng Ji,Li Songlin,Dou Fuqi,et al.Preparation and microstructure characterization of a nano-sized Ti4+-doped Ag Sn O2electrical contact material[J].Rare Metals,2009,28(1):19-23.
• [8]Zin Zhijie,Liu Shaohong,Sun Xudong,et al.The effects of citric acid on the synthesis and performance of silver-tin oxide electrical contact materials[J].Journal of Alloys and Compounds,2014,558:30-35.
• [9]张国庆.Ag-Sn O2触点材料制备及其相关基础研究[D].长沙:中南大学,2007.
• [10]Marek Galanty,Pawel Kazanowski,Panya Kansuwan,et al.Consolidation of metal powders during the extrusion process[J].Journal of Materials Science and Engineering A Processing Technology,2002(125/126):491-496.
• [11]吴春萍.Ag-Sn合金氧化机理与Ag-Sn O2材料的高温塑性变形行为研究[D].长沙:中南大学,2009.
• [12]Xu Canhui,Yi Danqing,Wu Chunping,et al.Microstructures and properties of silver-based contact material fabricated by hot extrusion of internal oxidized Ag-Sn-Sb alloy powders[J].Materials Science and Engineering A,2012,538:202-209.
• [13]付翀,姜凤阳,王俊勃,等.La掺杂对Ag Sn O2电接触合金阴极侵蚀区成分的影响[J].电工技术学报,2010,25(5):44-47.
• [14]Wang J B,Zhang Y,Yang M G,et al.Observation of arc dis-charging process of nanocomposite Ag-Sn O2and la-doped AgSn O2contact with a high-speed camera[J].Materials Science and Engineering B,2006,13:230-234.
• [15]Didier Jeannot,Jacques Pinard,Pierre Ramoni,et al.Physical and chemical properties of metal oxide additions to AgSn O2contact materials and predictions of electrical perfor-mance[J].IEEE Transactions on Components Packaging,and Manufacturing Technology-part A,1994,17(1):17-23.
• [16]Ye Qibin,Wang Yaping.Redistribution of Sn O2particles in Ag/Sn O2materials during rapid solidification[J].Materials Science and Engineering A,2007,449/451:1045-1048.