SiCAl电子封装材料制备工艺研究进展Progress in preparation of SiCAl electronic packaging composites
谢斌;王晓刚;
摘要(Abstract):
介绍SiCAl复合材料,综述了国内外SiCAl电子封装材料及构件所涉及的无压浸渗,粉末注射成型,共喷射沉积等多种制备工艺;并分析各种方法的优缺点,指出SiCAl制备方法的发展趋势。
关键词(KeyWords): SiCAl复合材料;无压浸渗;复合料浆;注射成型;综述
基金项目(Foundation): 国家自然科学基金资助项目(51074123);; 陕西省科学技术研究发展计划项目(2010TG-02)
作者(Author): 谢斌;王晓刚;
Email:
DOI: 10.14024/j.cnki.1004-244x.2013.05.014
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