谢斌;王晓刚;

• 1:西安科技大学材料科学与工程学院陕西省硅镁产业节能与多联产工程技术研究中心

摘要(Abstract)：

介绍SiCAl复合材料,综述了国内外SiCAl电子封装材料及构件所涉及的无压浸渗,粉末注射成型,共喷射沉积等多种制备工艺;并分析各种方法的优缺点,指出SiCAl制备方法的发展趋势。

关键词(KeyWords)： SiCAl复合材料;无压浸渗;复合料浆;注射成型;综述

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金资助项目(51074123);; 陕西省科学技术研究发展计划项目(2010TG-02)

作者(Author): 谢斌;王晓刚;

Email:

DOI: 10.14024/j.cnki.1004-244x.2013.05.014

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