谢斌;王晓刚;

• 1:西安科技大学材料科学与工程学院陕西省硅镁产业节能与多联产工程技术研究中心

摘要(Abstract)：

介绍SiCAl复合材料,综述了国内外SiCAl电子封装材料及构件所涉及的无压浸渗,粉末注射成型,共喷射沉积等多种制备工艺;并分析各种方法的优缺点,指出SiCAl制备方法的发展趋势。

关键词(KeyWords)： SiCAl复合材料;无压浸渗;复合料浆;注射成型;综述

Abstract:

Keywords:

基金项目(Foundation): 国家自然科学基金资助项目(51074123);; 陕西省科学技术研究发展计划项目(2010TG-02)

作者(Author): 谢斌;王晓刚;

Email:

DOI:

参考文献(References)：

• [1]Otiaba K C,Ekere N N,Amalu E H,et al.Thermal manage ment materials for electronic control unit:trends,processing technology and R and D challenges[J].Advanced Materials Research,2011,367:301-307.
• [2]Xiong Bowen,Xu Zhifeng,Yan Qingsong,et al.Fabrication of SiC nanoparticulates reinforced Al matrix composites by combining pressureless infiltration with ball milling and cold pressing technology[J].Journal of Alloys and Compounds,2010,497(1/2):L1-L4.
• [3]Wang K,Cheng J F,Sun W J,et al.An approach for increase of reinforcement content in particle rich zone of centrifugally cast SiCp/Al composites[J].Journal of Composite Materials,2012,46(9):1021-1027.
• [4]Sch bel M,Fiedler G,Peter Degischer H,et al.The effects of different architectures on thermal fatigue in particle reinforced MMC for heat sink applications[J].Advanced Materials Re search,2009,59:177-181.
• [5]Singla M,Dwivedi D D,Singh L,et al.Development of alumini um based silicon carbide particulate metal matrix composite[J].Journal of Minerals&Materials Characterization&Engi neering,2009,8(6):455-467.
• [6]Chu Ke,Jia Chengchang,Liang Xuebing,et al.The thermal conductivity of pressure infltrated SiCp/Al composites with var ious size distributions:experimental study and modeling[J].Materials and Design,2009,30(9):3497-3503.
• [7]Ramu G,Bauri R.Effect of equal channel angular pressing(ECAP)on microstructure and properties of Al SiCp compos ites[J].Materials&Design,2009,30(9):3554-3559.
• [8]Cui Yan,Wang Lifeng,Ren Jianyue.Multi functional SiC/Al composites for aerospace applications[J].Chinese Journal of Aeronautics,2008,21:578-584.
• [9]Aigbodion V S,Hassan S B.Effect of thermal ageing character istics of Al Si Fe/SiC particulate composite synthesized by double stir casting[J].The Journal of Engineering Research,2010,7(1):53-61.
• [10]Liu Z Y,Wang Q Z,Xiao B L,et al.Clustering model on the tensile strength of PM processed SiCp/Al composites[J].Com posites Part A:Applied Science and Manufacturing,2010,41(11):1686-1692.
• [11]Thermol transfer composites.Cool products for hot applica tions[OL].[2013-03-12].http://www.thermaltc.com/prod ucts.html.
• [12]CPS technologies.Reliability with smart composite products[O L].[2013-03-12].http://www.alsic.com/index.html.
• [13]张强,姜龙涛,武高辉.无压浸渗法制备氧化态SiC颗粒增强铝基复合材料[J].无机材料学报,2012,27(4):353-357.
• [14]石锦罡,姚辉,陈名海,等.铜包裹碳化硅颗粒复合粉体的化学原位沉积制备与表征[J].无机材料学报,2012,27(8):795-799.
• [15]Thermol transfer composites.Cool products for hot applica tions[O L].[2012-12-12].http://www.thermaltc.com/tech nologies.html.
• [16]Thermol transfer composites.Cool products for hot applica tions[OL].[2012-12-12].http://www.thermaltc.com/mate rials.html.
• [17]Zahedi A M,Javadpour J,Rezaie H R,et al.The effect of processing conditions on the microstructure and impact behavior of melt infiltrated Al/SiCp composites[J].Ceramics International,2011,37:3335-3341.
• [18]Ren Shubin,He Xinbo,Qu Xuanhui,et al.Effect of con trolled interfacial reaction on the microstructure and proper ties of the SiCp/Al composites prepared by pressureless infil tration[J].Journal of Alloys and Compounds,2008,455(1/2):424-431.
• [19]崔岩,郭顺,赵会友.高体份SiCp/Al复合材料型芯法无压浸渗近净成形制备技术[J].航空材料学报,2010,30(6):51-56.
• [20]Xue C,Yu J K,Zhang Z Q.In situ joining of titanium to SiC/Al composites by low pressure infiltration[J].Materials&De sign,2013,47:267-273.
• [21]Sree Manu K M,Resmi V G,M Brahmakumar,et al.Synthe sis of porous SiC preform and squeeze infiltration processing of aluminium SiC metal ceramic composites[J].Materials Science Forum,2012,710:371-376.
• [22]Chu Ke,Jia Chengchang,Liang Xuebing,et al.Experimental and modeling study of the thermal conductivity of SiCp/Al composites with bimodal size distribution[J].Journal of Mate rials Science,2009,44(16):4370-4378.
• [23]Zhu Xiaomin,Yu Jiakang,Wang Xinyu.Microstructure and properties of Al/Si/SiC composites for electronic packaging[J].Transactions of Nonferrous Metals Society of China,2012,22(7):1686-169.
• [24]Zhang Qiang,Wu Gaohui,Chen Guoqin,et al.The thermal expansion and mechanical properties of high reinforcement content SiCp/Al composites fabricated by squeeze casting tech nology[J].Composites Part A:Applied Science and Manufac turing,2003,34(11):1023-1027.
• [25]Lee J M,Lee S K,Hong S J.Microstructures and thermal properties of A356/SiCp composites fabricated by liquid pressing method[J].Materials and Design,2012,37:313-316.
• [26]He Xinbo,Qu Xuanhui,Ren Shubin,et al.Net shape forming of composite packages with high thermal conductivity[J].Science in China Series E:Technological Sciences,2009,52(1):238-242.
• [27]Sabuj Mallik,Ndy Ekere,Chris Best,et al.Investigation of thermal management materials for automotive electronic control units[J].Applied Thermal Engineering,2011,31:355-362.
• [28]Amirkhanlou S,Niroumand B.Development of Al356/SiCp cast composites by injection of SiCpcontaining composite powders[J].Materials&Design,2011,32(4):1895-1902.
• [29]Qu Xuanhui,Zhang Lin,Wu Mao,et al.Review of metal matrix composites with high thermal conductivity for thermalmanagement applications[J].Progress in Natural Science:Materials International,2011,21:189-197.
• [30]Li W,Chen Z H,Chen D,et al.Low cycle fatigue behavior ofSiCp/Al Si composites produced by spray deposition[J].Materials Science and Engineering A,2010,527(29/30):7631-7637.
• [31]贺毅强.多层喷射共沉积制备SiCp/Al-8.5Fe-1.3V-1.7Si复合材料[J].复合材料学报,2012,29(2):109-114.
• [32]Chen Zhigang,Chen Zhenhua,Tang Guoning.Processing,microstructure,and mechanical properties of large spray deposited hypoeutectic Al Si alloy tubular preform[J].Journal ofMatarials Engineering and Preformance,2011,20(2):238-243.